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Volumn 19, Issue 5, 1998, Pages 160-162

Effects of buried layer geometry on characteristics of double polysilicon bipolar transistors

Author keywords

Analog; Bipolar transistors; Buried layer; Bv CEO; Subcollector

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC BREAKDOWN OF SOLIDS; OPTIMIZATION;

EID: 0345902565     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.669735     Document Type: Article
Times cited : (3)

References (6)
  • 2
    • 0024705153 scopus 로고
    • A 20-ps Si bipolar IC using advanced super self-aligned process technology with collector ion implantation
    • July
    • S. Konaka, E. Yamamoto, K. Sakuma, Y. Amemiya, and T. Sakai, "A 20-ps Si bipolar IC using advanced super self-aligned process technology with collector ion implantation," IEEE Trans. Electron Devices, vol. 36, pp. 1370-1375, July 1989.
    • (1989) IEEE Trans. Electron Devices , vol.36 , pp. 1370-1375
    • Konaka, S.1    Yamamoto, E.2    Sakuma, K.3    Amemiya, Y.4    Sakai, T.5
  • 3
    • 84937658108 scopus 로고
    • T) fall-off at high current densities
    • Jan.
    • T) fall-off at high current densities," IRE Trans. Electron Devices, vol. ED-9, pp 164-174, Jan. 1962.
    • (1962) IRE Trans. Electron Devices , vol.ED-9 , pp. 164-174
    • Kirk, C.T.1
  • 5
    • 0029391707 scopus 로고
    • A low cost and low power silicon npn bipolar process with NMOS transistors (ADRF) for RF and microwave applications
    • Oct.
    • K. K. O, P. Garone, C. Tsai, G. Dawe, B. Scharf, T. Tewksbury, C. Kermarrec, and J. Yasaitis, "A low cost and low power silicon npn bipolar process with NMOS transistors (ADRF) for RF and microwave applications," IEEE Trans. Electron Devices, vol. 42, pp. 1831-1840, Oct. 1995.
    • (1995) IEEE Trans. Electron Devices , vol.42 , pp. 1831-1840
    • O, K.K.1    Garone, P.2    Tsai, C.3    Dawe, G.4    Scharf, B.5    Tewksbury, T.6    Kermarrec, C.7    Yasaitis, J.8


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.