Thermal expansion behavior of ruthenium aluminides

Scripta Materialia

Volumn 50, Issue 6, 2004, Pages 845-848

  Tryon, B ^a   Pollock, T M ^a   Gigliotti, M F X ^b   Hemker, K ^c  

^a UNIVERSITY OF MICHIGAN   (United States)

^b GE GLOBAL RESEARCH   (United States)

^c Johns Hopkins University   (United States)

Author keywords

Coatings; Intermetallic compounds; Thermal expansion behavior

Indexed keywords

COMPOSITION; CRACKS; DILATOMETERS; HIGH TEMPERATURE EFFECTS; INTERMETALLICS; MELTING; MOLECULAR STRUCTURE; STOICHIOMETRY; THERMAL BARRIER COATINGS; THERMAL EXPANSION;

DISPLACEMENTS; THERMAL STRAIN;

RUTHENIUM COMPOUNDS;

EID: 0345868382     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2003.12.009     Document Type: Article

References (19)

1. Fleischer R.L., Field R.D., Briant C.L. Metall. Mater. Trans. A. 22A:1991;403.
2. Lu D.C., Pollock T.M. Acta. Mater. 47:1998;1035.
3. Lu D.C., Pollock T.M. Mater. Res. Soc. Symp. Proc. 552:1999;KK7.11.1.
4. Pollock T.M., Lu D.C., Shi X., Eow K. Mater. Sci. Eng. A. 317:2001;241.
5. Wolff I.M. J. Met. 34:1997.
6. Wolff I.M., Sauthoff G., Cornish L.A., DeV Steyn H., Coetzee R. Nathal M.V., Darolia R., Liu C.T., Matrin P.L., Miracle D.B., Wagner R., Yamaguchi M. Structural Intermetallics. 1997;815 TMS.
7. Fleischer R.L. Metall. Mater. Trans. A. 24A:1993;227.
8. Spitsberg IT, Darolia R, Jackson MR, Zhao J, Schaeffer JC. US Patent #6,306,254. 2001.
9. Alperine S, Fournes J, Josso P, Leger J, Malie A, Manesse D. US Patent #5,843,585. 1998.
10. Somani M., Muraleedharan K., Birla N., Singh V., Prasad Y. Metall. Mater. Trans. A. 25A:1994;1693.
11. Touloukian Y.S., Kirby R.K., Taylor R.E., Desai P.D. Thermal expansion: metallic elements and alloys. 1975;IFI/Plenum.
12. Clark R.W., Whittenberger J.D. Thermal Expansion, 8. 1981;Plenum Press. p. 189.
13. Pan D., Chen M.W., Wright P.K., Hemker K.J. Acta. Mater. 51:2003;2205.
14. Evans A.G., Mumm D.R., Hutchinson J.W., Meier G.H., Pettit F.S. Prog. Mater. Sci. 46:2001;505.
15. Wright P.K., Evans A.G. Curr. Opin. Solid State Mater. Sci. 4:1999;255.
16. Stiger M., Yanar N., Topping M., Pettit F., Meier G. Z. Metallkd. 90:1999;1069.
17. Touloukian Y.S., Kirby R.K., Taylor R.E., Lee T.Y.R. Thermal expansion: nonmetallic solids. 1977;IFI/Plenum.
18. Karlsson A.M., Evans A.G. Acta. Mater. 49:2001;1793.
19. Rickerby DS, Bell SR, Wing RG. US Patent #5,981,091. 1999.