Electroless Deposition of Palladium Using Hypophosphite as a Reducing Agent

Plating and Surface Finishing

Volumn 86, Issue 6, 1999, Pages 104-107

  Djokic S S ^a  

^a Westaim Corporation   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345867428     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. Y. Okinaka & C. Wolowodiuk, Electroless Deposition of Platinum Group Metals in Electroless Plating: Fundamentals and Applications, G.O. Mallory & J.B. Hajdu, Eds., AESF, Orlando, FL, 1990; p. 421.
2. R.N. Rhoda, Trans. Inst. Met. Fin., 36, 82 (1959).
3. A. Sergienko, U.S. patent 3,418,143 (1968).
4. F. Pearlstein & R.F. Weightman, Plating, 56, 1158 (1969).
5. A.I. Zayats, I.A. Stepanova & A.V. Gorodyskii, Zashch. Metall., 9, 116 (1973).
6. N.M. Martyak, S. Wetterer, L. Harrison, M. McNeil, R. Heu & A.A. Nederer, Plat. and Surf. Fin., 80, 60 (June 1993).
7. S.S. Djokić, J. Electrochem. Soc., Submitted for publication, (1998).