Covalent Attachment of Gold Nanoparticles onto the Thiol-terminated Surface through Au-S Bonding

Acta Physico - Chimica Sinica

Volumn 15, Issue 11, 1999, Pages 964-965

  Hu, Ruisheng ^a   Liu, Shantang ^a   Zhu, Tao ^a   Liu, Zhongfan ^a   Huang, Xiaohua ^b   Huang, Huizhong ^b  

^a PEKING UNIVERSITY   (China)

^b Peking University   (China)

Author keywords

Assembly; Au S bonding; Gold nanoparticles

Indexed keywords

EID: 0345766919     PISSN: 10006818     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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