Plasma and Cu-Seed Layer Characteristics using VHF (60 MHz) Magnetron Sputtering System

Shinku/Journal of the Vacuum Society of Japan

Volumn 45, Issue 9, 2002, Pages 693-698

  Sato, Makoto ^a   Nagahama, Hanako ^a   Hayashi, Toshihiko ^a   Watanabe, Eisaku ^a   Nakagawa, Yukito ^a   Wickramanayaka, Sunil ^a   Hasegawa, Shinya ^a   Mizuno, Shigeru ^a  

^a Equipment Division ANELVA Corporation ^*  (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345617040     PISSN: 05598516     EISSN: None     Source Type: Journal    
DOI: 10.3131/jvsj.45.693     Document Type: Article

References (4)

1. T. Nogami, et al.: Advanced Metallization Conference, Colorado Springs, 1998, p313.
2. Oleg A. PoPov: High Density Plasma Sources, (NOYES PUBLICATIONS 1995), p172.
3. Oda. S: Plasma Sources Sci. Technol, (1993), 2: 26-29.
4. Michael A. Lieberman, Allan J. Lichtenberg: Principles of Plasasma Doscharges and Materials Processing, (John Wiley & Sons, Inc, 1994), p 354.