Colored Conversion Films of Mo-S-Cu Cluster Compounds on a Copper Surface

Plating and Surface Finishing

Volumn 83, Issue 5, 1996, Pages 142-145

  Ye, X R ^a   Xin, X Q ^a,b,c   Zhou, H N ^a  

^a NANJING UNIVERSITY   (China)

^b NANJING UNIVERSITY   (China)

^c GEORGETOWN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345538625     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (36)

1. R. Tournier, Oberfläche Surface, 4, 13 (1991).
2. A. Hasebrink, Galvanotechnik, 8, 997 (1985).
3. Europ. Pat. Appl., 492, 566.
4. T. Tamanoi and M. Sugiyama, J. Surf. Finish. Soc. Japan, 11, 1035 (1992).
5. R.W. Farrell, Jr., Products Fin., 5, 42 (1990).
6. L. Jun, Materials Protection (China), 6, 39 (1982).
7. S. Yaguang, Electroplat. & Pollut. Control (China), 4(6), 36 (1984).
8. L. Lixin, Electroplat. & Pollut. Control (China), 6(3), 37 (1986).
9. M. Fageng, Materials Protection (China), 5, 32(1990).
10. L. Gang and Y. Lu, Electroplating & Pollution Control (China), 11(6), 21 (1991).
11. H. Silman, G. Lisserlis and A.F. Averill, Protective and Decorative Coating for Metals, Finishing Publications Ltd., 1978; pp. 241-245.
12. G.B. Hogaboom, Proc. 26th Ann. Conv. Amer. Etectroplaters' Soc., 180 (1938).
13. S. Yaguang, Electroplating & Finishing (China), 6, 24 (1986).
14. W. Quanfa, Electroplating & Pollution Control (China), 8(5), 10 (1988).
15. Z. Qian, L. Chaozhi, Materials Protection (China), 1, 39 (1993).
16. I.I. Stavnitser & Sh. G. Pilavov, Russ. Pat. 1 355 642.
17. R. Jostes, A. Muller and E. Diemann, J. Mol. Struct. (Theochem.), 137, 311 (1986).
18. J.W. McDonald, G.D. Friesen, L.D. Rosenhein and W.E. Newton, Inorg. Chim. Acta., 72, 205 (1983).
19. X.Q. Xin, J.P. Lang, K.B. Yu, Z.Y. Zhou, M.Q. Chen, P.J. Zheng, J.H. Cai and B.S. Kang, J. Inorg. Chem., 8, 472 (1992).
20. A. Muller, E. Diemann, R. Jostes and H. Bogge, Angew. Chem., 93, 957 (1981).
21. K.F. Miller, A.E. Bruce, J.L. Corbin, S. Wherland and E.I. Stiefel, J. Am. Chem. Soc., 102, 5104 (1980).
22. K.P. Callahan and P.A. Piliero, Inorg. Chem., 19, 2619 (1980).
23. W.H. Pan, M.E. Leonowicz and E.I. Stiefel, Inorg. Chem., 22, 672 (1983).
24. Y. Jeannin, F. Secheresse, S. Bernes and F. Robert, Inorg. Chim. Acta., 198, 493 (1992).
25. H.W. Hou, J.P. Lang, J.G. Li and X.Q. Xin, J. Inorg. Chem., 2, 218 (1994).
26. A. Muller, E. Diemann, R. Jostes and H. Bogge, Angew. Chem. Int. Ed. Engl., 20, 934 (1981).
27. A. Muller, H.G. Tolle and H. Bogge, Z. Anorg. Allg. Chem., 171, 115 (1980).
28. B.H. Tieckelmann, H.C. Silvis, T.A. Kent, B.H. Huynh, J.V. Waszczak, B.K. Teo and B.A. Averill, J. Am. Chem. Soc., 102, 5550 (1980).
29. A. Muller, H.H. Heinsen and G. Vandrish, Inorg. Chem., 13, 1001 (1974).
30. X.R. Ye, H.W. Hou, X.Q. Xin and C.F. Hammer, Appl. Surf. Sci., 89, 151 (1995).
31. X.R. Ye and X.Q. Xin, Acta Chimica Sinica, 53, 462 (1995).
32. S. Sarkar and S.B.S. Mishra, Coor. Chem. Rev., 59, 239 (1984).
33. X.R. Ye, H.W. Hou and X.Q. Xin, Chin. J. Appl. Chem., 12, 5 (1995).
34. X.R. Ye and X.Q. Xin, J.C.S. Faraday Trans, (submitted).
35. S.W. Gaarenstroom and N. Winograd, J. Chem. Phys., 67, 3500 (1977).
36. N.S. Meinty, T.E. Rummery, M.G. Cook and O. Owen, J. Electrochem. Soc., 123, 1165 (1976).