Microstrip silicon-MEMS package for wafer-level chip-scale microwave packaging

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 9 A, 2003, Pages 5531-5535

  Lee, Hai Young ^a   Kwon, Young Soo ^a   Song, Yo Tak ^a   Park, Jae Young ^b  

^a Ajou University   (South Korea)

^b LG Electronics Inc   (South Korea)

Author keywords

HRS; MEMS; MMICs; Package; Wafer level packaging

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC FIELD EFFECTS; FINITE ELEMENT METHOD; INSERTION LOSSES; LEAKAGE CURRENTS; MICROWAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SHIELDING; SILICON WAFERS;

DE-EMBEDDING MEASUREMENT; LOW TEMPERATURE CO-FIRED CERAMIC; MICROWAVE DEVICE PACKAGING; PACKAGE RESONANCE; WAFER LEVEL CHIP SCALE MICROWAVE PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 0345356980     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.5531     Document Type: Article

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