A power spectrum analysis of surface generation in ultraprecision machining of Al/SiC metal matrix composites

Materials and Manufacturing Processes

Volumn 18, Issue 6, 2003, Pages 929-942

  Cheung, C F ^a   Chan, K C ^a   Lee, W B ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Cracks; Cut through; Interference of tool; Material swelling; Metal matrix composites (MMCs); Optimization; Pits; Power spectrum analysis; Pulled out; Quality; Reinforcement; Single point diamond turning; Surface generation; Ultraprecision machining; Vibration

Indexed keywords

ALUMINUM; CRACKS; CUTTING; MACHINING; OPTIMIZATION; REINFORCEMENT; SILICON CARBIDE; SURFACE ROUGHNESS; SWELLING; VIBRATIONS (MECHANICAL);

POWER SPECTRUM ANALYSIS; SINGLE-POINT DIAMOND TURNING; SURFACE GENERATION; ULTRAPRECISION MACHINING;

METALLIC MATRIX COMPOSITES;

EID: 0345328162     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-120025080     Document Type: Article

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