Morphology of Silicon wafer surfaces: A comparative study with Atomic Force Microscopy and other techniques

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2862, Issue , 1996, Pages 18-27

  Wagner, P ^a   Gerber, H A ^a   Graf D ^a   Schmolke, R ^a   Suhren, M ^a  

^a SILTRONIC AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BANDWIDTH; CRYSTAL DEFECTS; FLAT PANEL DISPLAYS; INSPECTION; LIGHT SCATTERING; POLISHING; SURFACE ROUGHNESS; SURFACE SCATTERING; TOPOGRAPHY;

COMPARATIVE STUDIES; EFFECTIVE CROSS SECTIONS; LIGHT SCATTERING TECHNIQUES; MIRROR POLISHED SILICON; PROFILING INSTRUMENT; SILICON WAFER SURFACE; SURFACE INSPECTION; TRANSITION REGIONS;

SILICON WAFERS;

EID: 0345212844     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.256205     Document Type: Conference Paper

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