Influence of heating process after packaging on physical properties of reimen (Korean noodle)

Nippon Shokuhin Kagaku Kogaku Kaishi

Volumn 45, Issue 4, 1998, Pages 223-231

  Toyama, Ryo ^a   Taneya, Shin'ichi ^b  

^a IWATE INDUSTRIAL RESEARCH INSTITUTE   (Japan)

^b IWATE UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0344978656     PISSN: 1341027X     EISSN: None     Source Type: Journal    
DOI: 10.3136/nskkk.45.223     Document Type: Article

References (15)

1. NAKAI, H., TANAB, R., ANDO, S., IKEDA, T. and NISHIZAWA, M. : 38th ICoMST, Clermont-ferrand France, p. 947 (1992).