Stimulation model for the vacuum-free diffusion bonding of aluminium metal-matrix composite

Journal of Materials Processing Technology

Volumn 89-90, Issue , 1999, Pages 344-349

  Lee, C S ^a   Li, H ^a   Chandel, R S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ALUMINUM ALLOYS; COMPUTER SIMULATION; DIFFUSION IN SOLIDS; INTERMETALLICS; OXIDES; SURFACE TOPOGRAPHY; WELDING;

ALUMINUM METAL MATRIX COMPOSITES; STIMULATION MODEL; VACUUM FREE DIFFUSION BONDING;

METALLIC MATRIX COMPOSITES;

EID: 0344671634     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(99)00145-4     Document Type: Article

References (8)

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2. C.H. Hamilton, in: R.I. Jaffee, P.M. Barte (Eds.), Pressure Requirements for Diffusion Bonding Titanium, Titanium Sci. and Tech. Vol. 1, Plenum Press, pp. 625-648, 1973.
3. G. Garmong, N.E. Paton, A.S. Argon, Attainment of full interfacial contact during diffusion bonding, Met. Trans. 6A (1975) 1269-1279.
4. P.M. Bartle, Diffusion bonding of metals, Institute of Physics and Physical Society Conference, Solid-Solid Interfaces, Nat. Physical Lab., UK, 2-3 May 1968.
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6. A.D. Hill, Modeling and assessment of diffusion bonding, Ph.D. Thesis, University of Cambridge, England, 1984.
7. H. Li, R.S. Chandel, C.S. Lee, Vacuum free diffusion bonding of aluminium metal matrix composite, Honors Year Report 1998, Nanyang Tech. Univ., Singapore.
8. T.G. Wall, Thick Film Process, Pergamon Press, 1987.