Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4977, Issue , 2003, Pages 542-554

  Ashkenasi, David ^a   Binder, Alexander ^a   Jaber, Houssam ^a   Kern, Holger ^a   Müller, Norbert ^a   Ziegert, Andreas ^a  

^a Laser und Medizin Technologie GmbH   (Germany)

Author keywords

Ceramics; Laser material micro machining (LM3); Semi conductors; Transparent dielectrics; Wafer substrates

Indexed keywords

DIELECTRIC MATERIALS; LASER PULSES; MICROELECTRONICS; NEODYMIUM LASERS;

CRYSTALLINE WAFER SUBSTRATES; LASER MATERIAL MICRO MACHINING;

LASER APPLICATIONS;

EID: 0344549114     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.479234     Document Type: Conference Paper

References (7)

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5. N. Kugler, S. Dong, Q. Lü, and H. Weber, "Investigation of misalignment sensitivity of a birefringence-compensated two-rod Nd:YAG laser system", Appl. Opt. 36, pp. 9359-9366, 1997.
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7. A. Binder, H. Kern, D. Ashkenasi, G. Müller, T. Riesbeck, H.-J. Eichler, "High quality micro laser drilling of metals and ceramics with maximum aspect ratio", SPIE 4977, in print, 2003