Application of the Transient Hot-Wire Technique to the Measurement of the Thermal Conductivity of Solids

International Journal of Thermophysics

Volumn 23, Issue 3, 2002, Pages 615-633

  Assael, M J ^a   Dix, M ^b   Gialou, K ^a   Vozar, L ^c   Wakeham, W A ^b  

^a ARISTOTLE UNIVERSITY OF THESSALONIKI   (Greece)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

^c The Philosopher University in Nitra Geoinformatics and Regional Development   (Slovakia)

Author keywords

Ceramic; Solid; Thermal conductivity; Transient hot wire

Indexed keywords

BOUNDARY CONDITIONS; FINITE ELEMENT METHOD; HEAT RESISTANCE; SOLIDS; THERMAL CONDUCTIVITY; THERMOCOUPLES; THERMOMETERS;

ELECTRICAL HEATING; TRANSIENT HOT-WIRES;

CERAMIC MATERIALS;

EID: 0344528782     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015494802462     Document Type: Article

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