Thin oligomer films deposited in the presence of a hot wolfram filament

Synthetic Metals

Volumn 101, Issue 1, 1999, Pages 646-

  Bernede J C ^a   D'Almeida, K ^a   Taoudi, H ^a   Martinez, F ^b   Neculqueo, G ^b   Diaz, F R ^c   Del Valle, K ^c   Lefrant, S ^d   Molinie P ^d   Louarn, G ^d  

^a FSTN   (France)

^b UNIVERSIDAD DE SANTIAGO DE CHILE   (Chile)

^c PONTIFICIA UNIVERSIDAD CATÓLICA DE CHILE   (Chile)

^d UNIVERSITÉ DE NANTES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; DEPOSITION; ELECTRON ENERGY LEVELS; ELECTRON SPIN RESONANCE SPECTROSCOPY; EVAPORATION; THIN FILMS; VACUUM APPLICATIONS; X RAY PHOTOELECTRON SPECTROSCOPY; OLIGOMERS; PLASTIC FILMS; VACUUM TECHNOLOGY;

HOT WOLFRAM FILAMENT; SURFACE CONTAMINATION; THERMAL EVAPORATION;

OLIGOMERS; CONDUCTIVE PLASTICS;

THERMAL EVAPORATION; WOLFRAM FILAMENTS;

EID: 0344286584     PISSN: 03796779     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0379-6779(98)01141-2     Document Type: Article

References (1)

1. Tamada M., Omichi H., Okvi N. Thin Solid Films 268 (1995) 18.