Reliability assessment for development of microtechnologies

Microsystem Technologies

Volumn 3, Issue 4, 1997, Pages 145-154

  Evans, J W ^a,c   Evans, J Y ^b  

^a Ajou University   (South Korea)

^b NASA GODDARD SPACE FLIGHT CENTER   (United States)

^c NASA HEADQUARTERS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0344239350     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050072     Document Type: Article

References (13)

1. Barela P; Bolin S; Bonner J; Ghaffarian R: (1995) NASA Electronic Packaging Miniaturization Thrust: Area Array Packaging RTOP. JPL Quarterly Technical Progress Report, 2nd Quarter
2. Box GEP; Hunter WG; Hunter JS: (1978), Statistics for Experimenters, New York, John Wiley and Sons, 1978
3. Evans J; Evans J; Prabu A; Dasgupta A: (1995) Software Environment for Reliability Assessment of Advanced Interconnect Technologies. Proc. of ASME International, Intersociety Electronic Packaging Conference, Lahaina, Hawaii
4. Evans J; Lall P; Bauernschub R: (1995) "A Framework for Reliability Modeling of Electronics. Proc. of the Reliability and Maintainability Symposium" (RAMS), Washington, D.C.
5. Evans J; Cushing MJ; Lall P; Bauernschub R: (1995) A Physics of Failure Approach to Addressing Device Reliability in Accelerated Testing of MCMs. Proc. of the IEEE MCM Conference, Santa Cruz, CA
6. Evans JW; Evans JY; Ryu BK: (1995) Designing and Building in Reliability in Advanced Microelectronic Assemblies and Structures. Proc. of IEEE IPFA Conference, Singapore
7. Hazelrigg G: (1996), Systems Engineering: Information Based Design, New York: Prentice Hall
8. MESUR Network Integrated Microelectronics Study, Final Report (1994) JPL D-1192
9. Prabu A; Barker DB; Pecht M; Evans J; Grieg W; Bernard E; Smith E: (1995) A Thermomechanical Fatigue Analysis of High Density Interconnect Vias. Proc. of ASME International, Intersociety Electronic Packaging Conference, Lahaina, Hawaii
10. Pecht M; Dasgupta A; Evans J; Evans J: (1994) Quality Conformance and Qualification of Microelectronic Packages and Interconnects. New York: John Wiley and Sons
11. Pecht M: (1994) Design Guidelines for Integrated Circuits, Hybrids and Multichip Modules. New York: John Wiley and Sons
12. RELTECH Interagency MCM Reliability Program Quarterly Report (January, 1994) NASA
13. Saito S: (1988) Fine Ceramics. Essex: Elsevier Science Publishing