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Volumn 160, Issue 2, 1998, Pages 187-195

The effect of milling and addition of dry binder on the interparticulate bonding mechanisms in sodium chloride tablets

Author keywords

Bonding mechanism; Dielectric constant; Dry binder; Liquid; Milling; Remaining tensile strength; Sodium chloride; Tablet

Indexed keywords

SODIUM CHLORIDE;

EID: 0344110478     PISSN: 03785173     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0378-5173(97)00307-4     Document Type: Article
Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.