The high strain rate dynamic stress-strain curve for OFHC copper

Materials Science Research International

Volumn 9, Issue 3, 2003, Pages 187-195

  Stevenson, Michael E ^a,b   Jones, Stanley E ^b   Bradt, Richard C ^b  

^a Metals and Materials Engineers LLC   (United States)

^b The University of Alabama   (United States)

Author keywords

Aluminum; Copper; Dynamic stress strain; Taylor test; Twinning

Indexed keywords

FINITE ELEMENT METHOD; GRAPH THEORY; MECHANICAL TESTING; MOLECULAR DYNAMICS; PLASTIC DEFORMATION; STRAIN HARDENING; STRAIN MEASUREMENT; STRAIN RATE; STRESSES; TWINNING;

BALLISTIC TESTS; DYNAMIC STRESS-STRAIN CURVE; QUASI-STATIC MECHANICAL TEST; TAYLOR TESTS;

COPPER;

EID: 0344062910     PISSN: 13411683     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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