Liners for tungsten plug applications with long throw and ionized PVD

Solid State Technology

Volumn 43, Issue 7, 2000, Pages 183-190

  Butler, D O ^a   Buchanan, Keith ^b   Burgess, Stephen R ^a   Ultansky, N ^a   Schmidbauer, S ^b  

^a Trikon Technologies Ltd   (United Kingdom)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; INTEGRATED CIRCUIT LAYOUT; INTERFACES (MATERIALS); MATERIALS TESTING; SUBSTRATES; TITANIUM; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING; LONG THROW PROCESSING; TUNGSTEN PLUG APPLICATIONS;

VAPOR DEPOSITION;

EID: 0343878100     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. D. C. Butler, PJ. Holverson, P. Rich, J. Hems, G. A. Dixit, S. Poarch, R. H. Havemann, Enhanced Bottom Coverage of Sub-Micron Contact Holes using a Novel Hi-Fill Ti/fiN Sputter Process," Advanced Metallization for ULSI Applications in 1994, pp. 277-284, 1994.
2. S. M. Rossnagel, J. Hopwood," Metal ion deposition from ionized magnetron sputtering discharge, J. Vac. Sei. Technol. B 12(1), pp. 449-453, Jan/Feb 1994.
3. N. Urbansky, M. Harris, D. C. Butler, P. Rich, K. Buchanan, C. Goergens, Advanced Long Throw PVD for Contact to Silicon and Via Applications," Advanced Metals Conference 1999, proceedings yet to be published.