Self-aligned metallization and reactive ion etched buried base contact solar cells

Progress in Photovoltaics: Research and Applications

Volumn 7, Issue 5, 1999, Pages 387-392

  Schaefer, Sebastian ^a   Lüdemann, Ralf ^a   Glunz, Stefan W ^a  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRIC POTENTIAL; ELECTRODES; ELECTROPLATING; EVAPORATION; MASKS; METALLIZING; METALS; REACTIVE ION ETCHING; SEMICONDUCTOR DOPING; SEMICONDUCTOR JUNCTIONS; SILICON WAFERS;

BURIED BASE CONTACT; DAMAGE FREE REACTIVE ION ETCH; EMITTER; LIFT OFF PROCESS; METAL EVAPORATION; SELF ALIGNED METALLIZATION;

SOLAR CELLS;

EID: 0343457911     PISSN: 10627995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-159X(199909/10)7:5<387::AID-PIP276>3.0.CO;2-3     Document Type: Article

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