Reliability study of chip-on-board technology for space applications with a 3-D stacked DRAM as test vehicle

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1679-1684

  Nhan, Elbert ^a   Le, Binh Q ^a   Maurer, Richard H ^a   Lew, Ark L ^a   Lander, Juan R ^a   Schwartz, Paul D ^a   Darrin, Ann Garrison ^b  

^a JOHNS HOPKINS UNIVERSITY   (United States)

^b NASA GODDARD SPACE FLIGHT CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343426680     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)

1. Union Carbide Technology Letter No. 9, "Properties of Parylene C,D,N," January 1985.
2. Reim, A. M., et al., "Real Time Monitoring of COB Encapsulations during HAST Testing," Proceedings of IEPS Conference, September 1991, pp. 118-134.