Finite element analysis of the open window plastic package for optical sensors

Sensors and Actuators, A: Physical

Volumn 76, Issue 1-3, 1999, Pages 386-394

  Cotofana, Carmen V B ^a   Bossche, Andre ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY;

OPEN QUAD FLAT PACKAGE; OPEN WINDOW PLASTIC PACKAGE; SENSOR PACKAGING;

OPTICAL SENSORS;

EID: 0343060860     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00036-9     Document Type: Article

References (9)

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4. ***, MIL Standard 883 C, Test Methods, IBM, 1987.
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