A constitutive model of polyimide films and its integration with finite element analysis for residual stress prediction in thin film interconnects

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1285-1290

  Wu, Sean X ^a   Yeh, Chao Pin ^a   Wyatt, Karl ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0342755233     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)

1. R.A. Fillion and C.A. Neugebauer, 1989, "High Density Multichip Packaging," Solid State Technology, September p.11.
2. J.G. Aday, et al, 1996, "A comparative Analysis of High Density PWB technologies," in Proceedings of Inter. Conference on Multichip Modules, p. 239
3. M. Pecht and X. Wu, 1994, "Characterization of Polyimides Used in High Density Interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, v17, n4, p.632.
4. E. Suhir, 1988, "An Approximate Analysis of Stresses in Multilayered Elastic Thin Films," ASME Journal of Applied Mechanics, v110, p.143.
5. M. Pecht, et al, 1995, "To Cut or Not to Cut: A Thermomechanical Stress Analysis of Polyimide Thin Film on Ceramic Structures," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, v18, n1, p.150.
6. S.R. White and H.T. Hahn, 1992, "Process modeling a composite materials: residual stress development during cure," Journal of Composite Materials, v26, n16, p.2403.
7. S.X. Wu, et al, 1995, "Process modeling for Multichip Thin Film Interconnects," Proceedings of ASME winter meeting, HTD-Vol. 319, p.175.
8. R.M. Christensen, 1982, Theory of Viscoelastics: An Introduction, 2nd edition, New York: Academic Press. CINDAS material database, 1996.
9. D. Read and J. Dally, 1994, "Mechanical Behavior of Aluminum and Copper Films." Proceeding of ASME winter meeting, AMD-Vol. 187, p.41.
10. S.R. White and H.T. Hahn, 1993, "Cure cycle optimization for the Reduction of Process-Induced Residual Stress in Composite Materials," Journal of Composite Materials, v27, n14, p1352.