Microelectromechanical Systems

IEEE Circuits and Devices Magazine

Volumn 9, Issue 4, 1993, Pages 14-22

  Mehregany, Mehran ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0342650128     PISSN: 87553996     EISSN: None     Source Type: Journal    
DOI: 10.1109/101.250229     Document Type: Article

References (18)

1. Journals: IEEE Transactions on Electron Devices; Journal of Micromechanics and Microengineering; Journal of Microelectromechanical Systems; Sensor and Actuators; and Sensors and Materials. International Conferences: International Conference on Solid-State Transducers (Biannually) and IEEE Micro Electro Mechanical Systems Workshop (Annually).
2. K. E. Petersen, “Silicon as a mechanical material,” Proc. IEEE, 70, pp. 420–57, May 1982.
3. M. Mehregany and Y. C. Tai, “Surface micro-machined mechanisms and micromotors,” J. Micromechanics and Microengineering, 1, pp. 73–85, June 1992.
4. M. Mehregany, S. D. Senturia, J. H. Lang, and P. Nagarkar, “Micromotor Fabrication,” IEEE Trans. on Electron Devices, vol. ED-39, pp. 2060–69, Sept. 1992.
5. W. H. Ko, J. T. Suminto, and G. J. Yeh, “Bonding techniques for microsensors,” in Micromachining and Micropackaging of Transducers, C. D. Fung, P. W. Cheung, W. H. Ko, and D. G. Fleming, Eds., Elsevier, Amsterdam, The Netherlands, 1985.
6. P. W. Barth, “Silicon fusion bonding for the fabrication of sensors, actuators, and microstructures,” Sensors and Actuators, A21-23, pp. 919–926, Feb.-April 1990.
7. H. Jerman, “Electrically-activated, normally-closed diaphragm valves,” in Technical Digest, 6th Int. Conf. on Solid-State Sensors and Actuators (San Francisco, CA, June 1991), pp. 1045–48.
8. R. Zengerle, A. Richter, and H. Sandmaier, “A micro membrane pump with electrostatic actuation,” in Proceedings, IEEE Micro Electro Mechanical Systems Workshop (Travemunde, Germany, Feb. 1992), pp. 19–24.
9. W. Ehrfeld, et al., “Fabrication of microstructures using the LIGA process,” in Proceedings, IEEE Microrobots and Teleoperators Workshop, (Hyannis, MA, Nov. 1987).
10. S. D. Senturia, “Microfabricated structures for the measurement of mechanical properties and adhesion of thin films,” in Technical Digest, 4th Int. Conf. on Solid-State Sensors and Actuators (Tokyo, Japan, June 1987), pp. 11–16.
11. M. Mehregany, R. T. Howe, and S. D. Senturia, “Novel microstructures for the in-situ measurement of mechanical properties of thin films,” J. Appl. Phys., 62, pp. 3579–84, 1987.
12. K. J. Gabriel, et al., “In situ measurements of friction and wear in integrated polysilicon microstructures,” Sensors and Actuators, vol. A21-23, pp. 184–188, Feb.-April 1990.
13. L.M. Schetky, “Shape-memory alloy,” Scientific American, 241, p. 74, Nov. 1979.
14. J. A. Walker, K. J. Gabriel, and M. Mehregany, “Thin-film processing of TiNi shape memory alloy,” Sensors and Actuators, A21—A23, p. 243, 1990.
15. W. C. Tang, T. -C. H. Nguyen, and R. T. Howe, “Laterally driven polysilicon resonant microstructures,” Sensors and Actuators, 20, pp. 25–32, Nov. 1989.
16. M. Mehregany and V. R. Dhuler, “Operation of Electrostatic micromotors in liquid environments,” J. Micromechanics and Microengineering, 2, pp. 1–3, March 1992.
17. S. D. Senturia, et al., “A computer-aided design system for microelectromechanical systems (MEMCAD),” J. of Microelectromechanical Systems, 1, pp. 3–13, March 1992.
18. S. B. Crary and Y. Zhang, “CAEMEMS: An integrated computer aided engineering workbench for micro-electro-mechanical systems,” in Proceedings, IEEE Micro Electro Mechanical Systems Workshop (Napa Valley, CA, Feb. 1990), pp. 113–114.