Phase-field modeling of rapid solidification

Materials Science and Engineering: A

Volumn 304-306, Issue 1-2, 2001, Pages 281-286

  Kim, Seong Gyoon ^a   Tae Kim, Won ^b  

^a Kunsan National University   (South Korea)

^b Chongju University   (South Korea)

Author keywords

Banded structure; Phase field model; Rapid solidification

Indexed keywords

COMPUTER SIMULATION; GRAIN SIZE AND SHAPE; MATHEMATICAL MODELS; RAPID SOLIDIFICATION; THERMAL GRADIENTS;

DENDRITES; PHASE FIELD MODELS;

ALUMINUM COPPER ALLOYS;

MICROSTRUCTURE; PHYSICAL PROPERTY;

EID: 0342502063     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01453-2     Document Type: Article

References (10)

1. Gremaud M., Carrard M., Kurz W. Acta Metall. Mater. 39:1991;1431.
2. Carrard M., Gremaud M., Zimmermann M., Kurz W. Acta Metall. Mater. 40:1992;983.
3. Conti M. Phys. Rev. E. 58:1998;6101.
4. Kim S.G., Kim W.T., Suzuki T. Phys. Rev. E. 60:1999;7186.
5. McFadden G.B., Wheeler A.A., Braun R.J., Coriell S.R., Sekerka R.F. Phys. Rev. E. 48:1993;2016.
6. Wheeler A.A., Boettinger W.J., McFadden G.B. Phys. Rev. A. 45:1992;7424.
7. Kim S.G., Kim W.T., Suzuki T. Phys. Rev. E. 58:1998;3316.
8. Tiaden J., Nestler B., Dipers H.J., Steinbach I. Physica D. 115:1998;73.
9. Warren J.A., Boettinger W.J. Acta Metall. Mater. 43:1995;689.
10. Kurz W., Trivedi R. Metall. Mater. Trans. A. 27:1996;625.