Fine scale 1-3 composites fabricated by the soft mold process: Preparation and modeling

Ferroelectrics

Volumn 241, Issue 1, 2000, Pages 67-73

  Gebhardt, Sylvia ^a   Schönecker, Andreas ^a   Steinhausen, Ralf ^b   Hauke, Tilo ^b   Seifert, Wolfgang ^b   Beige, Horst ^b  

^a FRAUNHOFER INSTITUTE FOR CERAMIC TECHNOLOGIES AND SYSTEMS   (Germany)

^b MARTIN LUTHER UNIVERSITY HALLE WITTENBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; CERAMIC MATERIALS; COMPUTATIONAL METHODS; FINITE ELEMENT METHOD; LEAD COMPOUNDS; MATHEMATICAL MODELS; NONMETALLIC MATRIX COMPOSITES; PIEZOELECTRIC MATERIALS; PLASTICS MOLDING;

ELECTROMECHANICAL PROPERTIES; PIEZOCERAMIC MATERIALS; SOFT MOLD PROCESS;

REINFORCED PLASTICS;

EID: 0342472189     PISSN: 00150193     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1080/00150190008224976     Document Type: Article

References (6)

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3. W.A. Smith, B.A. Auld. IEEE Trans. Ultrasonics, Ferroelectr., and Frequ. Contr., 38, 40 (1991).
4. W.A. Smith, B.A. Auld. IEEE Trans. Ultrasonics, Ferroelectr., and Frequ.Contr., 40, 41 (1993).
5. U. Rabe, Fraunhofer IZFP, Saarbrücken, Germany, private communication.
6. R. Steinhausen, T. Hauke, W. Seifert, H. Beige, W. Watzka, S. Seifert, D. Sporn, S. Starke, A. Schönecker. J. Europ. Ceram. Soc., 19, 1289 (1999).