Stress Analysis And Strength Evaluation of Single-lap Band Adhesive Joints Subjected to External Bending Moments

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1998-Z, Issue , 1998, Pages 67-75

  Liu, Jiemin ^a   Sawa, Toshiyuki ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

Adhesive joints; Band bonding; Bending moments; Contact problem; Interface; Joint strength; Single lap joint; Stress analysis; Stress singularity; Two dimensional theory of elasticity

Indexed keywords

BENDING MOMENTS; ELASTIC MODULI; ELASTICITY; FINITE ELEMENT METHOD; STRAIN; STRESS ANALYSIS;

ADHERENDS; ADHESIVE BOND; BAND BONDINGS; CONTACT PROBLEM; JOINT STRENGTH; SINGLE LAP JOINTS; SINGLE LAPS; STRESS SINGULARITIES; STRESSES ANALYSIS; TWO-DIMENSIONAL THEORY OF ELASTICITIES;

ADHESIVE JOINTS;

EID: 0342405260     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1998-1118     Document Type: Conference Paper

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