Shape and energies of a dynamically propagating crack under bending

Journal of Materials Research

Volumn 18, Issue 10, 2003, Pages 2379-2386

  Sherman, Dov ^a   Be'ery, Ilan ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; BENDING (DEFORMATION); CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; FRACTURE TESTING; POLYCRYSTALLINE MATERIALS; SILICON WAFERS; SINGLE CRYSTALS;

CRACK LOCI;

CRACK PROPAGATION;

EID: 0242660077     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0333     Document Type: Article

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