메뉴 건너뛰기




Volumn 18, Issue 11, 2003, Pages 2724-2729

Thermal shock of porous silicon nitride with preferentially aligned grains

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; COMPUTATIONAL METHODS; CRACK INITIATION; ELASTIC MODULI; FRACTURE; POROUS SILICON; QUENCHING; SHOCK TESTING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; VOLUME FRACTION;

EID: 0242636981     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0379     Document Type: Article
Times cited : (5)

References (29)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.