|
Volumn 18, Issue 11, 2003, Pages 2724-2729
|
Thermal shock of porous silicon nitride with preferentially aligned grains
a b,c a
c
IHI CORPORATION
(Japan)
|
Author keywords
[No Author keywords available]
|
Indexed keywords
BENDING STRENGTH;
COMPUTATIONAL METHODS;
CRACK INITIATION;
ELASTIC MODULI;
FRACTURE;
POROUS SILICON;
QUENCHING;
SHOCK TESTING;
THERMAL CONDUCTIVITY;
THERMAL EXPANSION;
VOLUME FRACTION;
PREFERENTIALLY ALIGNED GRAINS;
THERMAL SHOCK;
SILICON NITRIDE;
|
EID: 0242636981
PISSN: 08842914
EISSN: None
Source Type: Journal
DOI: 10.1557/JMR.2003.0379 Document Type: Article |
Times cited : (5)
|
References (29)
|