How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5048, Issue , 2003, Pages 73-82

  Dost, Michael ^a   Vogel, Dietmar ^b   Winkler, Thomas ^a   Vogel, Jürgen ^c   Erb, Rolf ^a   Kieselstein, Eva ^a   Michel, Bernd ^b  

^a Chemnitzer Werkstoffmechanik GmbH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

Deformation; Detection; Digital image processing; Image correlation; Object identification

Indexed keywords

ALGORITHMS; CORRELATION METHODS; DEFORMATION; IMAGE ANALYSIS; NANOSTRUCTURED MATERIALS; PROBLEM SOLVING; SECURITY SYSTEMS;

VIDEO IMAGES;

NONDESTRUCTIVE EXAMINATION;

EID: 0242609927     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.484373     Document Type: Conference Paper

References (8)

1. Yuh-Jin Chao, Michael A. Sutton, "Accurate Measurement of Two- and Three-Dimensional Surface Deformation for Fracture Specimens by Computer Vision", in: Experimental techniques in fracture, Ed.: Jonathan S. Epstein, pp. 59-93, VCH Publishers, Inc. New York, 1993
2. M. Dost, E. Kieselstein, R. Erb, "Displacement Analysis by means of Grey Scale Correlation at Digitised Images and Image Sequence Evaluation for Micro- and Nanoscale Applications", Micro Materials and Nanomaterials, issue 1 (2002), Fraunhofer IZM, Micromaterials Center, Berlin, pp. 30-35
3. M. Dost, N.Rümmler, E. Kieselstein, R. Erb, V. Hillmann, V. Großer, "Correlation Analysis at Grey Scale Patterns in an in-situ Measuring Module for Microsystem Technology", Materials Mechanics - Fracture Mechanics - Micromechanics, Eds. T. Winkler, A. Schubert, pp. 259-266, Berlin/Chemnitz 1999
4. J. Auersperg, A, Schubert, D. Vogel, B. Michel, H. Reichl, "Fracture and Damage Evaluation in Chip Scale Packages and Flip Chip Assemblies by FEA and MicroDAC", Symp. on Application of Fracture Mechanics in Electronic Packaging (ASM) AMD-Vol. 222/EEP-Vol. 20, pp. 133-138, Dallas, TX, USA, Nov. 16.-21, 1997,
5. J. Auersperg, D. Vogel, J. Simon, A. Schubert, B. Michel, "Reliability Evaluation of Chip Scale Packages by FEA and microDAC", Symp. on Design and Reliability of Solders and Solder Interconnects, TMS Annual Meeting, Orlando (USA), Feb. 9-13, 1997
6. Vogel.D., Kühnert, R., Dost, M., Michel, B., "Deformation of Packaging Materials Properties Utilizing Image Correlation Techniques", J. of Electronic Packaging 124(2002), 345-351
7. Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B., Vogel, J.; Bombach, C.; Grosser, V., Vogel, D., Michel, B., "UNIDAC - cross correlation based deformaion analysis at digitised micrographs to study material behaviour and parameters in MST", Proc. of Internat. Conference MicroMaterials 2000, Berlin, April 17-19, 2000
8. Dost, M.; Vogel, J.; Döring, R, "Einrichtung für die thermische Belastung zur lokalen Materialkennwertermittlung an Mikrokomponenten", tm Technisches Messen, 68(2001)2, S. 61 ff, Oldenbourg Wissenschaftsverlag München