Effect of thermal treatment on failure modes in tungsten wire

Materials Science and Engineering: A

Volumn 298, Issue 1-2, 2001, Pages 73-78

  Bourque, P P ^a,b   Bahr, D F ^a   Norton, M G ^a  

^a Washington State University   (United States)

^b University of Arizona   (United States)

Author keywords

Fractography; Fracture; Tungsten

Indexed keywords

FRACTOGRAPHY; FRACTURE MECHANICS; GRAIN BOUNDARIES; HEAT TREATMENT; TEXTURES; TUNGSTEN; WIRE; FRACTURE;

FAILURE SURFACE; FINE GRAIN STRUCTURE; GRAIN-BOUNDARIES; INTERGRANULAR FAILURES; K-STRONG; MICRO VOIDS; MODE OF FAILURES; THERMAL HISTORY; TRANSGRANULAR; TUNGSTEN WIRES;

FRACTURE; TUNGSTEN;

EID: 0242549884     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(00)01337-x     Document Type: Article

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