Optimum viscoelastic designer materials for minimizing failure probabilities during composite curing

Journal of Thermal Stresses

Volumn 26, Issue 6, 2003, Pages 547-557

  Hilton, Harry H ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Curing Processes; Designer Materials; Probability Of Failure; Thermal Stresses; Viscoelasticity

Indexed keywords

COMPUTER SIMULATION; CURING; FAILURE (MECHANICAL); NUMERICAL METHODS; PROBABILITY; THERMAL STRESS; VISCOELASTICITY;

COMPOSITE CURING; THERMAL STRESS CONTROL; VISCOELASTIC DESIGNER MATERIALS; VISCOELASTIC STRUCTURES;

COMPOSITE MATERIALS;

EID: 0242526874     PISSN: 01495739     EISSN: 1521074X     Source Type: Journal    
DOI: 10.1080/713855956     Document Type: Article

References (18)

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