A novel ultrasonic transducer backing from porous epoxy resin-titanium-silane coupling agent and plasticizer composites

Materials Letters

Volumn 58, Issue 1-2, 2004, Pages 154-158

  El Tantawy, Farid ^a   Sung, Yong Kiel ^b  

^a Suez Canal University   (Egypt)

^b Dongguk University   (South Korea)

Author keywords

Backing; Epoxy resin; High attenuation; Materials composite; Mechanical properties; Microstructure; Titanium; Ultrasonic properties

Indexed keywords

ACOUSTIC IMPEDANCE; ELECTROMAGNETIC WAVE ATTENUATION; EPOXY RESINS; MICROSTRUCTURE; PLASTICIZERS; SILANES; ULTRASONIC TRANSDUCERS;

EPOXY COMPOSITES;

COMPOSITE MATERIALS;

EID: 0242406878     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(03)00435-X     Document Type: Article

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