Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions

Microelectronics Journal

Volumn 34, Issue 12 SPEC.ISS., 2003, Pages 1143-1151

  Carubelli, S ^a   Khatir, Z ^a  

^a Lab des Technologies Nouvelles   (France)

Author keywords

Compact model; Electrothermal simulation; Multichip power device; Temperature measurements; Thermal modelling

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; DENSIFICATION; ELECTRIC TRACTION; POWER CONVERTERS; STRENGTH OF MATERIALS; THERMOANALYSIS;

THERMAL MODELING;

MULTICHIP MODULES;

EID: 0242406725     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(03)00205-2     Document Type: Conference Paper

References (12)

1. Lewis R.W., Morgan K., Thomas H.R., Seetharamu K.N. The Finite Element Method in Heat Transfer Analysis. 1996;Wiley, New York.
2. Yun C.S., Regli P., Waldmeyer J., Fichtner W. Static and dynamic thermal characteristics of IGBT power modules. Proceedings of the 11th International Symposium Power Semiconductor Devices and IC's. 1999;. pp. 37-40.
3. Brebbia C.A., Wrobel L.C. Boundary Element Methods in Heat Transfer. 1992;Computational Mechanics Publications and Elsevier Applied Science.
4. Guven I., Chan C.L., Madenci E. Transient two-dimensional thermal analysis of electronic packages by the boundary element method. IEEE Trans. Adv. Packaging. 22:(3):1999;476-486.
5. Khatir Z., Lefebvre S. Thermal Analysis of Power Cycling Effects on High Power IGBT Modules by the Boundary Element Method. Proc. 17th IEEE Semi-Therm Symposium, San José, March. vol. 17:2001.
6. Profumo F., Tenconi A., Facelli S., Passerini B. Implementation and Validation of a Thermal Model for Analysis, Design and Characterisation of Multichip Power Electronic Devices. IEEE Trans Ind Appl. 35:(3):1999.
7. Gerstenmaier Y.C., Wachutka G. A new Procedure for the Calculation of the Temperature Development in Electronic System. European Conference on Power Electronics and Applications, (EPE), Lausanne. 1999.
8. Carmona M., Marco S., Palacin J., Samitier J. A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form. IEEE Trans. Comp. Packag. Manufact. Technol. 22:(2):1999.
9. Yun C.S., Malberti P., Ciappa M., Fichtner W. Thermal Component Model for Electrothermal Analysis of IGBT Module Systems. IEEE Trans. Advanced. Packag. 24:(3):2001.
10. G. Coquery, S. Carubelli, F. Lecoq, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, European Symposium on the Reliability of Electron Devices, Failures Physics and Analysis, Arcachon, 2001.
11. ® Thermometer - model 790 Technical Documentation, 1997.
12. Release notes 12.1 for Matlab 6.1 Documentation, May 2001.