Revisited criterion to prevent kinking of a crack out of a bi-material interface under the presence of in-plane residual stresses - A global approach

International Journal of Engineering Science

Volumn 42, Issue 3-4, 2004, Pages 257-270

  Lee, Woong ^a   Shin, Hyunho ^b   Yoo, Yo Han ^b  

^a Yonsei University   (South Korea)

^b Agency for Defence Development   (South Korea)

Author keywords

Crack kinking; Interface crack; Layered systems; Residual stress

Indexed keywords

CRACK PROPAGATION; DISSIMILAR MATERIALS; ELASTIC MODULI; NUMERICAL METHODS; RESIDUAL STRESSES;

KINKING;

INTERFACES (MATERIALS);

EID: 0242365786     PISSN: 00207225     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijengsci.2003.07.004     Document Type: Article

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