A new permanent ESD and corrosion resistant reactive barrier packaging material

TAPPI - Polymers, Laminations and Coatings Conference

Volumn , Issue , 2001, Pages 381-387

  Franey, John P ^a   Donaldson, Keith ^a  

^a NONE

Author keywords

Active Barrier; CD; Chlorine; Copper; Corrosion; Digital data; Electronics; ESD; Silver; Static; Sulfur

Indexed keywords

BONDING; CORROSION RESISTANCE; ELECTRIC DISCHARGES; ELECTROSTATICS; FUNCTIONAL POLYMERS; INJECTION MOLDING; OXIDATION; RESINS; SILVERWARE;

ACTIVE BARRIERS;

PACKAGING MATERIALS;

EID: 0142198900     PISSN: 1047305X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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3. K.K. Mohanty, J.M.Ottino, and H.T.Davis, Reaction and transport in disordered composite media: Introduction to percolation concepts, Chem. Eng. Sci. 37, 905, 1982.
4. B.J.Jachym, Conduction in carbon black-doped polymers, in Carbon Black-Polymer Composites, E.K.Sichel Ed., pp 103-134, Marcel Decker, New York, 1982.
5. M.R.Havens, Understanding Pink Poly, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, pp. 95-101, 1989.
6. J.P.Franey, G.W.Kammlott, and T.E.Graedel, Corrosion Sci., 25, 2, 1985.
7. R.P.Turco, R.C.Whitten, O.B.Toon, J.P.Pollack, and P.Hamill, Nature 283-292, 1980.
8. T.E.Graedel, G.W.Kammlott, and, J.P.Franey, Corrosion Sci., 212, 663, 1981.