Durability of isocyanate resin adhesives for wood IV: Degradation under constant steam heating

Journal of Wood Science

Volumn 48, Issue 5, 2002, Pages 387-393

  Umemura, Kenji ^a   Takahashi, Akihiro ^b   Kawai, Shuichi ^c  

^a FORESTRY AND FOREST PRODUCTS RESEARCH INSTITUTE   (Japan)

^b Mitsui Takeda Chemicals   (Japan)

^c KYOTO UNIVERSITY   (Japan)

Author keywords

Bond strength; Durability; Isocyanate adhesives; Steam heating; Wood adhesives

Indexed keywords

ACTIVATION ENERGY; ADHESIVES; BOND STRENGTH (CHEMICAL); DEGRADATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEATING; RESINS; STEAM; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

DRY HEATING;

WOOD;

ACTIVATION ENERGY; ADHESIVES; DEGRADATION; STEAM HEATING; SYNTHETIC POLYMERS; WOOD;

EID: 0142134903     PISSN: 14350211     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00770698     Document Type: Article

References (16)

1. Saito F, Watanabe T, Suzuki S (1985) Particle-bond durability of emulsifiable polymeric MDI bonded particleboards (in Japanese with summary and figure captions in English). Mokuzai Gakkaishi 31:1028-1033
2. Umemura K, Kawai S (2002) Durability of isocyanate resin adhesives for wood. III. Degradation under constant dry heating. J Wood Sci 48:380-386
3. Gillespie RH (1980) Evaluating durability of adhesive-bonded wood joints. In: Proceedings of 1980 Symposium "Wood Adhesives - Research, Application and Needs," pp 168-177
4. Horioka K (1968) Review of adhesion durability (in Japanese). J Adhes Soc Jpn 4:375-400
5. Horioka K (1979) The theory for durability of adhesion (in Japanese). J Adhes Soc Jpn 15:430-434
6. Northcott PL, Colbeck HGM (1960) Prediction of plywood bond durability. For Prod J 10:403-408
7. Gillespie RH, River BH (1975) Durability of adhesives in plywood: dry heat effects by rate-process analysis. For Prod J 25(7):26-32
8. Sasaki H, Kaneda H, Maku T (1976) Dry-heat degradation of plywood-type joint. Wood Res 59/60:58-69
9. Gillespie RH (1968) Parameters for determining heat and moisture resistance of a urea-resin in plywood joints. For Prod J 18(8):35-41
10. Gillespie RH (1965) Accelerated aging of adhesives in plywoodtype joints. For Prod J 15(9):369-378
11. Umemura K, Takahashi A, Kawai S (1998) Durability of isocyanate resin adhesives for wood. I. Thermal properties of isocyanate resin cured with water. J Wood Sci 44:204-210
12. Umemura K, Takahashi A, Kawai S (1999) Durability of isocyanate resin adhesives for wood. II. Effect of the addition of several polyols on the thermal properties. J Appl Polym Sci 74:1807-1814
13. Umemura K, Kawai S (2002) Effect of polyol on thermo-oxidative degradation of isocyanate resin for wood adhesives. J Wood Sci 48:25-31
14. Subiyanto B, Kawai S, Tanahashi M, Sasaki H (1989) Curing conditions of particleboard adhesives. II. Curing of adhesives under high steam pressures or temperatures. Mokuzai Gakkaishi 35:419-423
15. Bailey FE Jr, Critchfield FE (1981) Chemical reaction sequence in the formation of water-blown, urethane foam. J Cell Plast 17:333-339
16. Kresta JE, Xiao HX, Suthar B, Baeten L, Li XH, Sun SP, Klempner D (1995) Recycling of polyurea-urethane RIM: polyurethanes '95 conference proceedings. In: Proceedings of the Technical/Marketing Conference, Chicago, pp 253-260