Changes in the mechanical properties of wood during a period of moisture conditioning

Journal of Wood Science

Volumn 47, Issue 4, 2001, Pages 254-261

  Ishimaru, Yutaka ^a   Oshima, Katsuhito ^a   Iida, Ikuho ^a  

^a KYOTO PREFECTURAL UNIVERSITY   (Japan)

Author keywords

Modulus of elasticity; Modulus of rupture; Moisture conditioned wood; Stress relaxation

Indexed keywords

ADSORPTION; ELASTIC MODULI; MOISTURE; STRESS RELAXATION;

MOISTURE CONDITIONING;

WOOD;

ADSORPTION; ELASTIC STRENGTH; MOISTURE; MOISTURE CONTENT; RUPTURE MODULUS; STRESS RELAXATION; WOOD; WOOD PROPERTIES;

CHAMAECYPARIS OBTUSA;

EID: 0142134453     PISSN: 14350211     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00766710     Document Type: Article

References (10)

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