Improvement mechanism of bondability in UF-bonded reed and wheat straw boards by silane coupling agent and extraction treatments

Journal of Wood Science

Volumn 45, Issue 4, 1999, Pages 299-305

  Han, Guangping ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Bondability; Reed straw; Silane coupling agent; Urea formaldehyde resin; Wheat straw

Indexed keywords

EID: 0142097664     PISSN: 14350211     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00833494     Document Type: Article

References (13)

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