Electrothermal failure of metallized film capacitor end connections-computation of temperature rise at connection spots

Journal of Applied Physics

Volumn 94, Issue 7, 2003, Pages 4449-4456

  Qi, Xiaoguang ^a   Boggs, Steven ^a  

^a UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; FINITE ELEMENT METHOD; PLASMA SPRAYING; THERMAL EFFECTS; VOLTAGE MEASUREMENT;

ELECTROTHERMAL FAILURES;

METALLIC FILMS;

EID: 0142057575     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1602947     Document Type: Article

References (7)

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3. X. Qi and S. A. Boggs, IEEE Trans. Dielectr. Electr. Insul. (submitted).
4. J. Kuang and S. A. Boggs, Proceedings of the 1997 ISH (International Symposium on High Voltage Engineering), Montreal, Canada. Vol. 6, 1997, pp. 141-144.
5. Walter Michaeli, Extrusion Dies for Plastics and Rubber, 2nd Ed., (Hanser Publishers, New York, 1992).
6. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd Ed., (Oxford University, New York, 1959), p. 76.
7. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd Ed. (Oxford University, New York, 1959), p. 80.