Product safety and the heat sink - Dilemma of minimizing radiated emissions and maximizing thermal cooling

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2003, Pages 134-137

  Georgerian, Richard ^a   Montrose, Mark I ^b  

^a Carrier Access Corporation   (United States)

^b Montrose Compliance Services Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; MICROPROCESSOR CHIPS; OPTIMIZATION; THERMAL EFFECTS; TRANSISTORS;

OPTIMAL COOLING; RADIATED EMISSIONS; THERMAL COOLING; THERMAL DISSIPATION; THERMAL RADIATOR;

HEAT SINKS;

EID: 0142009484     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Soule, Christopher A. August 1, 2002, "Optimization of Fin Spacing: How Close Is Too Close?" Power Electronics Technology.
2. Montrose, Mark I., 2000. Printed Circuit Board Design Techniques for EMC Compliance, Second Edition, IEEE Press.