An efficient PEEC algorithm for modeling of LTCC RF circuits with finite metal strip thickness

IEEE Microwave and Wireless Components Letters

Volumn 13, Issue 9, 2003, Pages 390-392

  Wu, Ke Li ^a   Yeung, Lap Kun ^a   Ding, Yan ^a  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CALCULATIONS; CAPACITANCE; CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRIC CONDUCTORS; INDUCTANCE; LOW TEMPERATURE PROPERTIES; MATHEMATICAL MODELS;

EQUIVALENT NETWORK MODEL; FINITE METAL THICKNESS; LOW TEMPERATURE CO-FIRED CERAMICS; PARTIAL ELEMENT EQUIVALENT CIRCUIT ALGORITHM;

EQUIVALENT CIRCUITS;

EID: 0141954022     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2003.817142     Document Type: Letter

References (3)

1. A. E. Ruehli, "Equivalent circuit models for three-dimensional multiconductor systems," IEEE Trans. Microwave Theory Tech., vol. MTT-22, pp. 216-220, Mar. 1974.
2. S. A. Teo, B. L. Ooi, S. T. Chew, and M. S. Leong, "A fast PEEC technique for full-wave parameters extraction of distributed elements," IEEE Microwave Wireless Comp. Letters, vol. 11, pp. 226-228, May 2001.
3. A. Sutono, J. Laskar, and W. R. Smith, "Development of three dimensional integrated bluetooth image reject filter," in 2000 IEEE MTT-S Int. Microwave Symp. Dig., vol. 1, pp. 339-342.