Strength of silicon nitride after thermal shock

Journal of the American Ceramic Society

Volumn 86, Issue 9, 2003, Pages 1619-1621

  She, Jihong ^a   Yang, Jian Feng ^a   Jayaseelan, Daniel Doni ^a   Ueno, Shunkichi ^a   Kondo, Naoki ^a   Ohji, Tatsuki ^a   Kanzaki, Shuzo ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPRESSIVE STRESS; HEATING; OXIDATION; QUENCHING; SURFACE CHEMISTRY; SURFACE PROPERTIES; TENSILE STRENGTH; THERMAL EFFECTS;

SOAKING; SURFACE OXIDATION; THERMAL SHOCK STRENGTH; WATER-QUENCHING TECHNIQUE;

SILICON NITRIDE;

EID: 0141938840     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2003.tb03527.x     Document Type: Article

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