Pressure-sensitive adhesives for electronic applications

Journal of Materials Science Letters

Volumn 22, Issue 18, 2003, Pages 1237-1239

  Novak I ^a   Florian S ^a  

^a INSTITUTE OF CHEMISTRY   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; FILLERS; MATERIALS TESTING; MECHANICAL PROPERTIES; ORGANIC POLYMERS; PARTICLE SIZE ANALYSIS;

ACRYLATE POLYMER MATRIX; CONDUCTIVE FILLERS; PRESSURE SENSITIVE ADHESIVES; TACKIFIER;

ADHESIVES;

EID: 0141906231     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1025441631408     Document Type: Article

References (10)

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