Relationship of interface microstructure and adhesion strength between Ti coating and diamond

Key Engineering Materials

Volumn 250, Issue , 2003, Pages 41-45

  Wang, Y H ^a   Zang, J B ^a   Wang, M Z ^a   Zheng, Y Z ^a  

^a YANSHAN UNIVERSITY   (China)

Author keywords

Bond strength; Diamond; Interface; Ti coating

Indexed keywords

ADHESION; ANNEALING; BONDING; DEPOSITION; GROWTH (MATERIALS); INTERFACES (MATERIALS); MAGNETRON SPUTTERING; MICROSTRUCTURE; MORPHOLOGY; REACTION KINETICS; TITANIUM;

CARBIDE FORMING ELEMENT; GROWTH MECHANISM; METALLIC COATING; POST-DEPOSITION ANNEALING; VACUUM SLOW VAPOR DEPOSITION;

DIAMONDS;

EID: 0141904256     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.250.41     Document Type: Article

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