Simulation of void growth in molten solder bumps

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 329-334

  Panton, Ronald L ^a   Lee, Jong W ^a   Goenka, Lakhi ^b   Achari, Achyuta ^b  

^a The University of Texas at Austin   (United States)

^b VISTEON CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUBBLE FORMATION; COMPUTER SIMULATION; MELTING; MOLTEN MATERIALS; SOLDERING ALLOYS; SUBSTRATES; SURFACE TENSION; VISCOSITY;

MOLTEN SOLDER BUMPS; VOID GROWTH;

ELECTRONICS PACKAGING;

EID: 0141884178     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1569954     Document Type: Article

References (6)

1. Chan, Y. C., Xie, D. J., and Lai, J. K. L., 1996, "Experimental Studies of Pore Formation in Surface Mount Solder Joints," Mater. Sci. Eng., B, 38(1-2), p. 53.
2. Goenka, L. N., and Achari, A., 1995, "Void Formation in Flip-Chip Solder Bumps: Part I," 18th IEEE/CHMT Symposium, Austin, TX.
3. Goenka, L. N., and Achari, A., 1996, "Void Formation in Flip-Chip Solder Bumps: Part II," Nineteenth IEEE/CHMT Symposium, Austin, TX.
4. Vural, C., 1998, private communication.
5. Davis, A. M. J., 1989, "Thermocapillary Convection in Liquid Bridges: Solution Structure and Eddy Motions," Phys. Fluids A, 1, p. 479.
6. Lee, J., 1999, "Analytical Model of Void Formation in Solder Bumps," M.S. thesis, University of Texas.