Monitoring polymer/clay nanocomposites compounding using a dielectric slit die

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 3, Issue , 2003, Pages 3326-3330

  Bur, Anthony J ^a   Roth, Steven C ^a   McBrearty, Michael ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Chemical ElectroPhysics Corp   (United States)

Author keywords

Clay nanocomposites; Dielectric sensor; Process monitoring; Slit die rheometer

Indexed keywords

COPOLYMERS; DIELECTRIC PROPERTIES; NANOSTRUCTURED MATERIALS; SENSORS;

DIELECTRIC SLIT DIES;

EXTRUSION MOLDING;

EID: 0141840643     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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4. K. W. Wagner, Archiv Elektrotech. 2, 371 (1914).
5. H. R. Dennis, D. L. Hunter, D. Chang, S. Kim, J. L. White, J. W. Cho, D. R. Paul, Polymer 42, 9513 (2001)
6. R. H. Cole, J. Chem. Phys. 23, 493 (1955).