Evolution of the elastic moduli at the early stage of copper sintering

Materials Letters

Volumn 57, Issue 28, 2003, Pages 4418-4423

  Yeheskel, O ^a,b   Pinkas, M ^a,b   Dariel, M P ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

^b NUCLEAR RESEARCH CENTER NEGEV   (Israel)

Author keywords

CIP; Copper; Elastic moduli; Nanomaterial; Porosity; Sintering; TEM

Indexed keywords

ELASTIC MODULI; NANOSTRUCTURED MATERIALS; POROSITY; SINTERING; TRANSMISSION ELECTRON MICROSCOPY;

SINTERED MATERIALS;

COPPER;

EID: 0141838938     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(03)00334-3     Document Type: Article

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