Nonshrinkable photoresists for ArF lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 II, Issue , 2003, Pages 689-697

  Kim, Jin Baek ^a   Oh, Tae Hwan ^a   Choi, Jae Hak ^a   Lee, Jae Jun ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Bile acid; Camphor; Nonshrinkable photoresist; Oxepan 2 one

Indexed keywords

CARBOXYLIC ACIDS; DEGASSING; OPTICAL DESIGN; OPTICAL INSTRUMENT LENSES; ORGANIC ACIDS; PHOTOLITHOGRAPHY; RING OPENING POLYMERIZATION; SHRINKAGE; SYNTHESIS (CHEMICAL);

BILE ACID; CAMPHOR; NONSHRINKABLE PHOTORESIST; OXEPAN-DIONE; POST EXPOSURE BAKE;

PHOTORESISTS;

EID: 0141834661     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485074     Document Type: Conference Paper

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