3D molecular interconnection technology

Journal of Micromechanics and Microengineering

Volumn 13, Issue 5, 2003, Pages 655-662

  Crawley, D ^a   Nikolic K ^a   Forshaw, M ^a   Ackermann, J ^b   Videlot, C ^b   Nguyen, T N ^c   Wang, L ^c   Sarro, P M ^c  

^a UNIVERSITY COLLEGE LONDON   (United Kingdom)

^b CNRS   (France)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY MEASUREMENT; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; MULTICHIP MODULES; ORGANIC POLYMERS; SPURIOUS SIGNAL NOISE;

CONDUCTIVE POLYMERS; ELECTRIC SIGNALS; MOLECULAR INTERCONNECTION TECHNOLOGY; MULTICHIP STACK STRUCTURE;

MICROELECTRONIC PROCESSING;

EID: 0141796723     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/5/317     Document Type: Article

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