Impacts of High Modulus Ultra Low-k/Cu 300 mm-wafer Integration for 65 nm Technology Node and Beyond

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2003, Pages 125-126

  Sone, S ^a   Ohashi, N ^a   Shin, H J ^a   Misawa, K ^a   Kaji, N ^a   Inukai, K ^a   Matsushita, A ^a   Sudou, K ^a   Tokitoh, S ^a   Kondo, S ^a   Yoon, B U ^a   Yoneda, K ^a   Yoshie, T ^a   Ohtsuka, N ^a   Okamura, H ^a   Toyoda, Y ^a   Shoji, F ^a   Nasuno, T ^a   Shimada, M ^a   Ogawa, S ^a   Matsumoto, I ^a   Kobayashi, N ^a   more..

^a Research Dept 2   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; ELECTRIC CONNECTORS; ORGANIC POLYMERS; PERMITTIVITY; PLASMA APPLICATIONS; WSI CIRCUITS;

PLASMA TREATMENT;

DIELECTRIC MATERIALS;

300 MM WAFERS; 65-NM-NODE; 65NM TECHNOLOGY; ARYLENE; HYBRID STRUCTURE; LOW-K MATERIALS; MULTI LEVEL INTERCONNECTS; POROUS MSQ; TECHNOLOGY NODES; ULTRA LOW-K;

EID: 0141761526     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. S.M. Jang et al., VLSI, pp. 18 (2002)
2. Simon Lin et al., IITC, pp. 146 (2001)
3. T. Jacobs et al., IITC, pp. 236 (2002)